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UK electronics engineering company offers specialist low pressure moulding technology

Country of Origin: United Kingdom
Reference Number: TOUK20210326001
Publication Date: 29 March 2021


UK company that specializes in the sealing and protection of electronics using low pressure injection moulding technology offers this technology to partners either under a licensing ageement or commercial agreement with technical assistance.


The UK family-run company was established in 2016.

The company specializes in moulding directly on to electronic assemblies, including PCBs (printed circuit boards), sensors and other sensitive components including LiPo and other batteries, providing a totally sealed and encapsulated product.
Low pressure injection moulding is a faster, cleaner and lower cost alternative to encapsulation. The process is non-toxic, a great advantage when compared to potting with epoxies and or urethanes.
Low Pressure Injection Moulding is a three-step process rather than an eight step process for potting. This removal of process steps reduces manufacturing time, labour and material costs and improves throughput, resulting in increased return on investment.
The company is offering equipment and a moulding solution for the electronics encapsulation and overmoulding services and expertise in how to use this equipment for the production of prototypes and low-volume production parts which can take a product from the design stage through to production. It is seeking partners under either a licensing agreement or alternatively a commercial agreement with technical assistance.

Advantages and Innovations

The company is unique in offering equipment for low pressure moulding which can protect electronics and make them waterproof, shock-proof and more resistant to damage than other solutions on the market. 
Low pressure injection moulding is the process of over-moulding electronic devices with Polyamides to protect them.
The PCB assembly or electronic part is placed in a specially manufactured aluminium mould tool, and completely surrounded with a liquid compound that effectively forms the housing for the device.
This provides a fast and cost-effective alternative to conventional encapsulation or potting, offering instant protection from moisture, vibration and other challenging environmental conditions.
There is zero waste, scrap is often recyclable and the process is environmentally friendly, giving off no toxic fumes. The end result is a tamper-proof and environmentally sealed product.

Stage Of Development

Already on the market

Requested partner

The company would like to work with prospective partners who are ideally electronics manufacturers looking to incorporate the innovative moulding technology into their production processes  either under a commercial agreement with technical assistance or under a licensing agreement whereby the partner works under the company branding.

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